Monolithic magnetic induction device
AssigneeThe Hong Kong University of Science and Technology
InventorsJohnny Kin On Sin, Rongxiang Wu, Ron Shu Yuen Hui
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AssigneeThe Hong Kong University of Science and Technology
InventorsJohnny Kin On Sin, Rongxiang Wu, Ron Shu Yuen Hui
Estimating the term…
Providing for a monolithic magnetic induction device having low DC resistance and small surface area is described herein. By way of example, the magnetic induction device can comprise a substrate (e.g., a semiconductor substrate) having trenches formed in a bottom layer of the substrate, and holes formed in the substrate between the trenches and an upper layer of the substrate. Additionally, the magnetic induction device can comprise a conductive coil embedded or deposited within the trenches. The magnetic induction device can further comprise a set of conductive vias formed in the holes that electrically connect the bottom layer of the substrate with the upper layer. Further, one or more integrated circuit components, such as active devices, can be formed in the upper layer, at least in part above the conductive coil. The vias can be utilized to connect to integrated circuit components with the conductive coil, where suitable.
A magnetic induction device for an integrated circuit, comprising:
A monolithic magnetic induction device, comprising:
Dependencies are inferred from the claim text.