Organic light-emitting diode (OLED) display and method of manufacturing the same
AssigneeSamsung Display Co., Ltd.
InventorChung Yi
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Abstract
An organic light-emitting diode (OLED) display and a method of manufacturing the same are disclosed. In one aspect, the method includes: forming a barrier layer on a base substrate of a mother panel, forming a plurality of display units in units of cell panels on the barrier layer and forming an encapsulation layer on each of the plurality of display units of the cell panels. The method further includes applying an organic film to an interface portion between the cell panels and cutting along the interface portion applied with the organic film. Accordingly, cracks are prevented from occurring in the barrier layer when the mother panel is cut in units of the cell panels, thereby reducing a defect rate of a product and stabilizing its quality.
Claims17
A method of manufacturing an organic light-emitting diode (OLED) display, the method comprising:
- forming a barrier layer on a base substrate of a mother panel;
- forming a plurality of display units in units of cell panels on the barrier layer;
- forming an encapsulation layer on each of the display units of the cell panels;
- applying an organic film to an interface portion between the cell panels, wherein the organic film contacts neither the display units nor the encapsulation layer;
- and
- cutting along the interface portion,
- wherein a groove is formed in the barrier layer, wherein at least a portion of the organic film is formed in the groove, and wherein the groove does not penetrate into the base substrate.
A method of manufacturing an organic light-emitting diode (OLED) display, the method comprising:
- forming a barrier layer on a base substrate of a mother panel;
- forming a plurality of display units in units of cell panels on the barrier layer;
- forming an encapsulation layer on each of the display units of the cell panels;
- applying an organic film to an interface portion between the cell panels, wherein the organic film contacts neither the display units nor the encapsulation layer;
- and
- cutting along the interface portion,
- wherein each of the display units comprises a thin film transistor (TFT) layer, a planarization film formed on the TFT layer, and a light-emitting unit formed on the planarization film,
- wherein the organic film is formed of the same material and is substantially simultaneously formed as the planarization film.
A method of manufacturing an organic light-emitting diode (OLED) display, the method comprising:
- forming a barrier layer on a base substrate of a mother panel;
- forming a plurality of display units in units of cell panels on the barrier layer;
- forming an encapsulation layer on each of the display units of the cell panels;
- applying an organic film to an interface portion between the cell panels;
- and
- cutting along the interface portion,
- wherein the base substrate is formed of polyimide,
- and wherein the method further comprises, before forming the barrier layer, attaching a carrier substrate formed of a glass material to another surface of the base substrate, and before the cutting along the interface portion, separating the carrier substrate from the base substrate.
An organic light-emitting diode (OLED) display comprising:
- a barrier layer formed on a base substrate;
- a display unit formed on the barrier layer;
- an encapsulation layer formed on the display unit;
- and
- an organic film formed at an edge portion of the barrier layer, wherein the organic film contacts neither the display unit nor the encapsulation layer,
- wherein a groove is formed in the barrier layer, wherein at least a portion of the organic film is formed in the groove, and wherein the groove does not penetrate into the base substrate.
Dependencies are inferred from the claim text.