Image sensor module and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJi Bum Cha, Sung Jae Lee, In Cheol Chang, Sung Jun Byun
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Abstract
There is provided an image sensor module, including: an image sensor having a small thickness of 175 μm or less and having a first coefficient of thermal expansion; a substrate having the image sensor mounted thereon and having a second coefficient of thermal expansion higher than the first coefficient of thermal expansion; and an adhesive layer disposed between the image sensor and the substrate and including an adhesive having a third coefficient of thermal expansion of 130 ppm/° C. or more at a glass transition temperature Tg or more.
Claims4
A method of manufacturing an image sensor module for a subminiature camera, the method comprising:
- dispensing an adhesive having a third coefficient of thermal expansion of 130 ppm/° C. or more at a glass transition temperature Tg or more of the adhesive to a substrate having a second coefficient of thermal expansion and a thickness of 175 μm or less, the adhesive having a thickness less than that of the image sensor;
- temporarily curing and attaching an image sensor having a first coefficient of thermal expansion to the substrate to which the adhesive has been dispensed;
- and
- curing the adhesive at the glass transition temperature Tg or more of the adhesive, the glass transition temperature of the adhesive being lower than a curing temperature of the adhesive,
- wherein pressure is applied for 1 to 2 seconds at a temperature range of 120° C. to 160° C. in the attaching of the image sensor to the substrate, and
- the curing of the adhesive is performed for about 120 seconds at about 120° C.
Dependencies are inferred from the claim text.