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US 9,287,307 B2Granted
Chip size package (CSP)
AssigneeSony Corporation
InventorsYukihisa Kinugasa, Toshihiro Furusawa, Yoshiteru Kamatani, Yoshihito Higashitsutsumi
Life of this patent
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Abstract
A chip size package (CSP) includes an antenna for wireless communication, used in signal transmission and reception with external substrates, the antenna being formed as a wiring of a rewiring layer, the rewiring layer being disposed between a silicon layer and solder bumps.
Claims5
A chip size package (CSP) comprising
- an antenna for wireless communication, used in signal transmission and reception with external substrates, the antenna being formed as a wiring of a rewiring layer, the rewiring layer being disposed between a silicon layer and solder bumps,
- wherein the antenna is connected to a circuit provided outside the CSP, and
- the wiring of the rewiring layer configuring the antenna has ends formed at positions where the solder bumps are formed.
A chip size package (CSP) comprising
- an antenna for wireless communication, used in signal transmission and reception with external substrates, the antenna being formed as a wiring of a rewiring layer, the rewiring layer being disposed between a silicon layer and solder bumps,
- wherein the CSP is mounted on a mounting substrate, and
- a part of the mounting substrate corresponding to the wiring of the rewiring layer configuring the antenna is hollowed, and a hole is provided at the hollowed part.
A chip size package (CSP) comprising
- an antenna for wireless communication, used in signal transmission and reception with external substrates, the antenna being formed as a wiring of a rewiring layer, the rewiring layer being disposed between a silicon layer and solder bumps, and
- wherein the CSP is configured as an image sensor.
Dependencies are inferred from the claim text.