Package substrate

A package substrate, comprising:

• an inner resin insulating interlayer;
• a first conductor layer formed on the inner resin insulating interlayer;
• a second conductor layer on which the inner resin insulating interlayer is formed;
• an outermost resin insulating interlayer formed on the first conductor layer;
• an outermost conductor layer formed on the outermost resin insulating interlayer and comprising a plurality of first pads and a plurality of second pads such that the plurality of first pads is positioned to mount a first electronic component on the outermost resin insulating interlayer and the plurality of second pads is positioned to mount a second electronic component on the outermost resin insulating interlayer;
• a plurality of outermost via conductors formed through the outermost resin insulating interlayer such that the plurality of outermost via conductors is connecting the first conductor layer and the outermost conductor layer;
• and
• a plurality of skip via conductors formed through the outermost resin insulating interlayer and the inner resin insulating interlayer such that the plurality of skip via conductors is connecting the outermost conductor layer and the second conductor layer,
• wherein the first conductor layer includes a first conductor circuit connecting two of the outermost via conductors, and the outermost conductor layer includes an outermost conductor circuit connecting one of the two of the outermost via conductors and one of the skip via conductors such that the first conductor circuit, the two of the outermost via conductors, the outermost conductor circuit and the one of the skip via conductors form a connection path connecting one of the second pads and the second conductor layer.