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US 9,287,246 B2Granted
Package assembly and methods for forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorHsien-Wei Chen
Life of this patent
Estimating the term…
Abstract
A device includes a first package component, and a second package component underlying the first package component. The second package component includes a first electrical connector at a top surface of the second package component, wherein the first electrical connector is bonded to the first package component. The second package component further includes a second electrical connector at the top surface of the second package component, wherein no package component is overlying and bonded to the second electrical connector.
Claims20
A system comprising:
- a first package component;
- a second package component, wherein each of the first and the second package components comprises:
- a first electrical connector and a second electrical connector, wherein a first relative position of the first electrical connector in the first package component is identical to a second relative position of the first electrical connector in the second package component, and a third relative position of the second electrical connector in the first package component is identical to a fourth relative position of the second electrical connector in the second package component;
- a first surface dielectric layer over the first package component, wherein the first electrical connector of the first package component is exposed through an opening in the first surface dielectric layer, and the second electrical connector of the first package component is covered by the first surface dielectric layer;
- and
- a second surface dielectric layer over the second package component, wherein the first surface dielectric layer and the second surface dielectric layer are formed of a same dielectric material, and both the first electrical connector and the second electrical connector of the second package component are exposed through the second surface dielectric layer.
3 more elements
A system comprising:
- a first package component;
- a second package component, wherein each of the first and the second package components comprises:
- a first metal pad and a second metal pad, wherein a first relative position of the first metal pad in the first package component is identical to a second relative position of the first metal pad in the second package component, and a third relative position of the second metal pad in the first package component is identical to a fourth relative position of the second metal pad in the second package component;
- a first solder region and a second solder region over and in contact with the first metal pad and the second metal pad, respectively;
- a third package component bonded to the first package component, wherein the first metal pad and the first solder region of the first package component are bonded to an additional metal pad of the third package component, and wherein the second metal pad of the first package component is not bonded to the third package component;
- and
- a fourth package component bonded to the second package component, wherein the first and the second metal pads and the first and the second solder regions of the second package component are bonded to additional metal pads of the fourth package component.
4 more elements
A system comprising:
- a first package component;
- a second package component, wherein each of the first package component and the second package component comprises:
- a surface dielectric layer, wherein first openings in the surface dielectric layer of the first package component have a first layout different from a second layout of second openings in the surface dielectric layer of the second package component;
- and
- remaining portions other than the surface dielectric layer, wherein the remaining portions of the first package component are identical to the remaining portions of the second package component;
- and
- a third package component and a fourth package component bonded to the first package component and the second package component, respectively.
4 more elements
Dependencies are inferred from the claim text.