Contoured package-on-package joint
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorJiun Yi Wu
Life of this patent
Estimating the term…
Abstract
A contoured package on package joint and a method for making the same are disclosed herein. A method for forming a device comprises providing a substrate having a package land and forming a mounting stud on the package land. A molded underfill is applied to the substrate and in contact with the mounting stud. A contoured stud surface is formed on the mounting stud is contoured and connecting member attached to the contoured stud surface with a second package attached to the connecting member. The connecting member may be solder and have a spherical shape. The contoured stud surface may be etched or mechanically formed to have a hemispherical shape conforming to the connecting member shape.
Claims20
A device, comprising:
- a package land disposed on a first side of a substrate;
- a mounting stud disposed on and in electrical contact with the package land, the mounting stud having a recessed contoured stud surface extending from a first sidewall to a second sidewall of the mounting stud, wherein the first sidewall is straight;
- and
- a molded underfill (MUF) disposed at the first side of the substrate and covering at least a portion of the mounting stud, the MUF extending along sidewalls of the mounting stud, the recessed contoured stud surface extending lower than an uppermost surface of the MUF.
A device, comprising:
- a first package having at least an interposer substrate, a redistribution layer (RDL) at a first side of the first package, and a semiconductor die on the interposer substrate, the semiconductor die extending a first distance away from the RDL;
- a plurality of package lands disposed in the RDL, a first surface of each package land exposed through a first surface of the RDL;
- a plurality of mounting studs, each of the plurality of mounting studs mounted on one of the plurality of package lands and extending away from the RDL a second distance larger than the first distance, and each of the plurality of mounting studs having a concave contoured stud surface, the concave contoured stud surface having a curved surface extending from a planar first sidewall of the mounting stud to a second sidewall of the mounting stud;
- a second package having a plurality of via lands exposed at a first surface of the second package;
- and
- a plurality of connecting members having a surface complementary to the concave contoured stud surface, each of the plurality of connecting members in contact with the concave contoured stud surface.
A device, comprising:
- a first package having at least an interposer substrate and a redistribution layer (RDL) at a first side of the first package, the RDL having first lands disposed at a first surface of the first package;
- mounting studs each mounted on one of the first lands, each of the mounting studs having a contoured stud surface that is located further away from the RDL than a semiconductor die electrically connected to the RDL, the semiconductor die being located on a same side of the RDL as the mounting studs, the contoured stud surface having a concave recess extending to a straight sidewall of a respective one of each of the mounting studs, the concave recess having a first width, the first width being substantially equal to a second width of the mounting studs;
- a molded underfill (MUF) disposed at the first side of a substrate and covering at least a portion of the mounting studs, wherein the MUF extends along a first sidewall and a second sidewall of each of the mounting studs, and wherein the concave recess extends lower than an uppermost surface of the MUF;
- a second package having a plurality of second lands disposed at a first surface of the second package;
- and
- connecting members each mounted to one of the second lands, each of the connecting members having a first surface portion in contact with the contoured stud surface and having a second surface portion along sidewalls of the connecting members spaced apart from the contoured stud surface;
- wherein the first surface portion and the second surface portion form a substantially smooth curved surface.
Dependencies are inferred from the claim text.