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AssigneeDanfoss Silicon Power GmbH
InventorsMathias Kock, Ronald Eisele
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The invention relates to a method for producing a connection between a semiconductor component and semiconductor component and semiconductor module resistant to high temperatures and temperature changes by means of a temperature impinging process, wherein a metal powder suspension is applied to the areas of the semiconductor module to be connected later; the suspension layer is dried, outgassing the volatile components and generating a porous layer; the porous layer is pre-sealed without complete sintering taking place throughout the suspension layer; and, in order to obtain a solid electrically and thermally conductive connection of a semiconductor module to a connection partner from the group of: substrate, further semiconductor or interconnect device, the connection is a sintered connection generated without compression by increasing the temperature and made of a dried metal powder suspension that has undergone a first transport-safe contact with the connection partner in a pre-compression step and has been solidified at zero pressure using temperature sintering.
A method for producing a high-temperature and temperature-change resistant connection between a semiconductor module, a connection partner and a contact tab, by means of a temperature impinging process, in which:
A method for producing a high-temperature and temperature-change resistant connection between a component, a connection partner and a contact tab, the method comprising:
Dependencies are inferred from the claim text.