Package structure with direct bond copper substrate

A package structure, comprising:

• a first insulation layer, wherein at least one first conductive via is formed in the first insulation layer;
• a first conductive layer disposed on a top surface of the first insulation layer and in contact with the at least one first conductive via, wherein the first conductive layer comprises at least one first conductive pattern;
• a direct bond copper substrate comprising a second conductive layer, a third conductive layer and a ceramic base, wherein the ceramic base is disposed on a bottom surface of the first insulation layer and exposed to the first insulation layer by a press-fit operation, the second conductive layer is disposed on a top surface of the ceramic base and embedded within the first insulation layer, and the third conductive layer is disposed on a bottom surface of the ceramic base;
• at least one first electronic component embedded within the first insulation layer and attached on the second conductive layer through a fixing material, wherein the first electronic component comprises at least one first conducting terminal, and the at least one first conducting terminal is electrically connected with the second conductive layer and/or electrically connected with the first conductive layer through the at least one first conductive via;
• and
• a plurality of pins, wherein the pins are disposed on and in contact with the corresponding first conductive patterns.

A package structure, comprising:

• a first insulation layer, wherein at least one first conductive via is formed in the first insulation layer;
• a first conductive layer disposed on a top surface of the first insulation layer and in contact with the at least one first conductive via, wherein the first conductive layer comprises at least one first conductive pattern;
• a direct bond copper substrate comprising a second conductive layer, a third conductive layer and a ceramic base, wherein the ceramic base is disposed on a bottom surface of the first insulation layer and exposed to the first insulation layer by a press-fit operation, the second conductive layer is disposed on a top surface of the ceramic base and embedded within the first insulation layer, and the third conductive layer is disposed on a bottom surface of the ceramic base;
• at least one first electronic component embedded within the first insulation layer and attached on the second conductive layer through a fixing material, wherein the first electronic component comprises at least one first conducting terminal, and the at least one first conducting terminal is electrically connected with the second conductive layer and/or electrically connected with the first conductive layer through the at least one first conductive via;
• a second insulation layer disposed on the first conductive layer and covering the first conductive layer, wherein the second insulation layer comprises at least one fourth conductive via;
• a fourth conductive layer disposed on a top surface of the second insulation layer and in contact with the at least one fourth conductive via;
• and
• a third electronic component embedded within the second insulation layer and attached on the first conductive layer through the fixing material, wherein the third electronic component comprises at least one third conducting terminal, and the at least one third conducting terminal is electrically connected with the first conductive layer and/or electrically connected with the fourth conductive layer through the at least one fourth conductive via.