US 9,287,230 B2Granted

Thermocompression for semiconductor chip assembly

AssigneeInternational Business Machines Corporation

InventorJulien Sylvestre

Life of this patent

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Abstract

An assembly of a semiconductor chip having pads to a substrate having pads aligned to receive the semiconductor chip is provided, whereby at least one of the semiconductor chip pads and substrate pads include solder bumps. The solder bumps are deformed against the substrate pads and the semiconductor chip pads, whereby an underfill material is applied to fill the gap between the semiconductor chip and substrate such that the underfill material envelopes both the deformed solder bumps and the substrate pads. The underfill material does not penetrate between the deformed solder bumps, the semiconductor chip pads, and the substrate pads based on a compression force causing the solder bumps to be deformed against the substrate pads and the semiconductor chip pads. At least one of the solder bumps have not been melted or reflowed to make a metallurgical bond between the semiconductor chip pads and the substrate pads.

Claims8

Dependent claims

A semiconductor chip assembly comprising:

a semiconductor chip having pads;
a substrate having pads aligned to receive the semiconductor chip, wherein at least one of the semiconductor chip pads and substrate pads have solder bumps, the solder bumps being deformed against the substrate pads and the semiconductor chip pads;
and
an underfill material applied to fill a gap between the semiconductor chip and the substrate, wherein the underfill material envelopes both the deformed solder bumps and the substrate pads, the underfill material not penetrating between the deformed solder bumps, the semiconductor chip pads, and the substrate pads based on a compression force causing the solder bumps to be deformed against the substrate pads and the semiconductor chip pads, and
wherein at least one of the solder bumps have not been melted or reflowed to make a metallurgical bond between the semiconductor chip pads and the substrate pads, and
wherein at least another one of the solder bumps have been melted or reflowed to make a metallurgical bond between the semiconductor chip pads and the substrate pads.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application: 14/525,340Filed 28 Oct 2014 · division
Priority: 14 Nov 2012
Published: US 2015/0123271 A17 May 2015
Granted: 15 Mar 2016
Term ends: Not estimatedThe source records don’t support an estimate.

Classification32 codes

H10W 90/701
Package configurations: characterised by the relative positions of pads or connectors relative to package parts
H10P 74/207
Characterised by the properties tested or measured, e.g. structural or electrical properties: electrical properties, e.g. testing or measuring of…
H10W 74/012
Manufacture or treatment: of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
H10W 74/15
Characterised by their shape or disposition: on active surfaces of flip-chip devices, e.g. underfills

Family

Application13/676,250Parent of this division · filed 14 Nov 2012
US 2015/0123271 A1Pre-grant publication · published 7 May 2015
US 8,932,909 B2Parent of this division
US 2014/0131855 A1Published application
US 9,287,230 B2This patent

From the US filing history. Foreign family members aren’t listed.