Electronic device with first and second contact pads and related methods

An electronic device comprising:

• a plurality of leads;
• an integrated circuit (IC) comprising first and second pluralities of bond pads;
• an encapsulation material adjacent said plurality of leads and said IC so said plurality of leads extends to a bottom surface of said encapsulation material, a lowermost portion of said plurality of leads defining a first plurality of contact pads at the bottom surface of said encapsulation material and arranged around a periphery of the bottom surface;
• a plurality of bond wires between said first plurality of bond pads and corresponding ones of said plurality of leads;
• and
• a plurality of conductors extending from said second plurality of bond pads to the bottom surface of said encapsulation material, said plurality of conductors defining a second plurality of contact pads arranged within the plurality of first contact pads at the bottom surface of said encapsulation material;
• said first plurality of contact pads, said second plurality of contact pads, and the bottom surface of said encapsulation material being aligned with each other.

A method for making an electronic device comprising:

• coupling a plurality of wire bonds between a first plurality of bond pads of an integrated circuit (IC) and corresponding ones of a plurality of leads;
• coupling a plurality of conductors to extend outwardly from a second plurality of bond pads of the IC;
• and
• forming an encapsulation material adjacent the plurality of leads and the IC so the plurality of leads extend to a bottom surface of the encapsulation material, a lowermost portion of the plurality of leads defining a first plurality of contact pads at the bottom surface of the encapsulation material;
• the plurality of conductors extending to the bottom surface and defining a second plurality of contact pads at the bottom surface of the encapsulation material;
• the first plurality of contact pads, the second plurality of contact pads, and the bottom surface of the encapsulation material being aligned with each other.

A method for making an electronic device comprising:

• coupling a plurality of wire bonds between a first plurality of bond pads of an integrated circuit (IC) and corresponding ones of a plurality of leads;
• coupling a plurality of conductors to extend outwardly from a second plurality of bond pads of the IC;
• coupling a conductive frame to the second plurality of bond pads, and severing portions of the conductive frame to define the plurality of conductors;
• and
• forming an encapsulation material adjacent the plurality of leads and the IC so the plurality of leads extend to a bottom surface of the encapsulation material defining a first plurality of contact pads, and so that the plurality of conductors extends to the bottom surface defining a second plurality of contact pads.

A method for making an electronic device comprising:

• coupling a plurality of wire bonds between a first plurality of bond pads of an integrated circuit (IC) and corresponding ones of a plurality of leads, the plurality of leads being initially part of a lead frame;
• coupling a plurality of conductors to extend outwardly from a second plurality of bond pads of the IC;
• and
• forming an encapsulation material adjacent the plurality of leads and the IC so the plurality of leads extend to a bottom surface of the encapsulation material defining a first plurality of contact pads, and so that the plurality of conductors extends to the bottom surface defining a second plurality of contact pads.