Apparatus and methods for reducing impact of high RF loss plating
AssigneeSkyworks Solutions, Inc.
InventorsWeimin Sun, Peter J. Zampardi, Jr., Hongxiao Shao
Life of this patent
Estimating the term…
Abstract
To reduce the radio frequency (RF) losses associated with high RF loss plating, such as, for example, Nickel/Palladium/Gold (Ni/Pd/Au) plating, an on-die passive device, such as a capacitor, resistor, or inductor, associated with a radio frequency integrated circuit (RFIC) is placed in an RF upper signal path with respect to the RF signal output of the RFIC. By placing the on-die passive device in the RF upper signal path, the RF current does not directly pass through the high RF loss plating material of the passive device bonding pad.
Claims20
An electronic circuit module configured to reduce signal losses, the electronic circuit module comprising:
- an electronic circuit device including a first lead, a second lead, a radio frequency (RF) output, and an integrated circuit die associated with a passive component;
- and
- a conductive path having a first bonding pad electrically connected to the first lead and a second bonding pad located on the conductive path between the first bonding pad and an output of the electronic circuit module and electrically connected to the second lead, the electronic circuit device configured such that the passive component electrically connects to the first lead and the RF output of the electronic circuit device electrically connects to the second lead.
An electronic circuit device configured to reduce signal losses, the electronic circuit device comprising:
- an integrated circuit die associated with an on-die passive component;
- a first lead configured to be electrically connected to a first bonding pad located on a conductive path;
- and
- a second lead configured to be electrically connected to a second bonding pad located on the conductive path between the first bonding pad and other circuitry, the on-die passive component electrically connecting to the first lead and an output of the electronic circuit device electrically connecting to the second lead.
A method for reducing signal losses in an electronic circuit module, the method comprising:
- fabricating an electronic circuit device including an output and an integrated circuit die associated with an on-die passive component;
- forming a first bonding pad on a conductive path and a second bonding pad on the conductive path between the first bonding pad and an output of the electronic circuit module;
- electrically connecting a first lead to the first bonding pad and electrically connecting a second lead to the second bonding pad;
- and
- electrically connecting the on-die passive component to the first lead and electrically connecting the output of the electronic circuit device to the second lead.
Dependencies are inferred from the claim text.