Chip level EMI shielding structure and manufacture method thereof
AssigneeUniversal Scientific Industrial (Shanghai) Co., Ltd.
InventorMing-Che Wu
Life of this patent
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Abstract
A chip level EMI shielding structure and manufacture method thereof are provided. The chip level EMI shielding structure includes a semiconductor substrate, at least one ground conductor line, a ground layer, and a connection structure. The ground conductor line is disposed on a first surface of the semiconductor substrate, and the ground layer is disposed on a second surface of the semiconductor substrate. The connection structure is formed on a lateral wall of the semiconductor substrate for connecting the ground conductor lines with the ground layer to form a shielding. With such arrangement, the chip level EMI shielding structure can reduce the chip size and the manufacturing cost.
Claims5
A chip level EMI shielding structure, comprising:
- a semiconductor substrate having a thickness bounded by opposing first and second surfaces;
- a plurality of ground conductor lines disposed on the first surface of the semiconductor substrate, each of the ground conductor lines positioned on an edge of the semiconductor substrate;
- at least one chip disposed on the first surface of the semiconductor substrate;
- a protective layer directly contacting and covering the chip, ground conductor lines, and portions of the first surface of the semiconductor substrate surrounding the chip and ground conductor lines;
- a plurality of metal conductor lines each having a surface portion spaced from the semiconductor substrate and overlaying an outer surface of the protective layer, each of the metal conductor lines having an extending portion extending through the protective layer and connected electrically to the chip;
- a ground layer disposed on the second surface of the semiconductor substrate extending between a first connection structure and a second connection structure respectively disposed on lateral walls of the semiconductor substrate for electrically connecting the ground conductor lines and the ground layer.
Dependencies are inferred from the claim text.