Dicing die-bonding film and method of forming a cut on the dicing die-bonding film
AssigneeCheil Industries Inc.
InventorsBaek Soung Park, Jae Won Choi, Sung Min Kim, In Hwan Kim, Jun Woo Lee, Su Ml Im
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Abstract
A dicing die-bonding film and a method of forming a groove in a dicing die-bonding film, the film including a base film; a pressure-sensitive adhesive layer stacked on the base film; and a bonding layer stacked on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer includes a first region overlapping with the bonding layer, and a second region not overlapping with the bonding layer, the second region including a third region adjacent to the first region, and a fourth region adjacent to the third region and having a groove formed therein.
Claims21
A dicing die-bonding film, comprising:
- a base film;
- a pressure-sensitive adhesive layer stacked on the base film;
- and
- a bonding layer stacked on the pressure-sensitive adhesive layer,
- wherein the pressure-sensitive adhesive layer includes:
- a first region overlapping with the bonding layer, and
- a second region not overlapping with the bonding layer, the second region including:
- a third region adjacent to the first region, and
- a fourth region adjacent to the third region and having a groove formed therein.
A dicing die-bonding film, comprising:
- a base film;
- a pressure-sensitive adhesive layer stacked on the base film;
- a bonding layer stacked on the pressure-sensitive adhesive layer;
- and
- a release film stacked on the bonding layer or the pressure-sensitive adhesive layer,
- wherein the pressure-sensitive adhesive layer includes:
- a first region overlapping with the bonding layer, and
- a second region surrounding the first region without overlapping with the bonding layer, and
- wherein at least one groove is formed through the base film and the second region.
A method of forming a groove in a dicing die-bonding film that includes a base film;
- a pressure-sensitive adhesive layer stacked on the base film;
- a bonding layer stacked on a central part of the pressure-sensitive adhesive layer;
- and a release film stacked on the bonding layer or the pressure-sensitive adhesive layer, the method comprising:
- inserting a knife blade into the dicing die-bonding film from the base film to a depth penetrating a region of the pressure-sensitive adhesive layer, on which the bonding layer is not stacked, without penetrating the release film.
Dependencies are inferred from the claim text.