Method of fabricating a semiconductor device with encapsulant

A method of fabricating a semiconductor device, comprising:

• providing a first layer, the first layer comprising through-holes;
• providing at least one semiconductor chip, the semiconductor chip comprising contact pads;
• placing the semiconductor chip onto the first layer with the contact pads being aligned with extending within the through-holes such that there is no intermediate material between the through-holes and the contact pads of the at least one semiconductor chip;
• applying an encapsulant material in a single layer over the semiconductor chip until the encapsulant material contacts the first layer thereby substantially surrounding the semiconductor chip;
• applying a conductive ink into the through-holes of the first layer and directly onto the contact pads of the semiconductor chip and curing or post-curing the encapsulant material at the same time as curing the applied conductive ink;
• and
• wherein the contact pads on the semiconductor chip are characterized by the absence of any connecting balls, bumps or other additional attachments thereto when the semiconductor chip is placed onto the first layer with the first surface facing the first layer.

A method of fabricating a plurality of semiconductor devices, comprising:

• providing a first layer, the first layer comprising through-holes prior to coupling with a semiconductor component;
• providing a plurality of semiconductor chips, each one of the semiconductor chips defining a first surface comprising contact elements and a second surface opposite to the first surface of the semiconductor chips and side surfaces between the first and second surfaces, respectively;
• placing the semiconductor chips onto the first layer with the first surface facing the first layer and with the contact elements being aligned and extending within the through-holes such that there is no intermediate material between the through-holes and the contact elements of the semiconductor chips;
• wherein the contact elements on the semiconductor chips are free of bumps, balls or any other attachments when the semiconductor chips are placed onto the first layer with the first surface facing the first layer;
• applying an encapsulant material over at least the side surfaces of the semiconductor chips;
• applying a conducting layer over the first layer and the through-holes directly onto the contact elements, the conducting layer comprising conducting areas, each one of the conducting areas connected with one of the contact elements, respectively;
• and
• dividing the resulting structure into semiconductor devices.