Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form

A method of making a semiconductor device, comprising:

• providing a plurality of semiconductor die;
• providing a carrier;
• disposing the semiconductor die over the carrier;
• forming a first bump over the semiconductor die while disposed over the carrier;
• disposing the semiconductor die and carrier over a first surface of a substrate;
• and
• bonding the first bump to the substrate by reflowing the first bump while the semiconductor die are disposed over the carrier.

A method of making a semiconductor device, comprising:

• providing a carrier;
• disposing a plurality of semiconductor die over the carrier;
• forming a plurality of first bumps over the semiconductor die;
• providing a substrate including a plurality of second bumps;
• and
• bonding the first bumps of the semiconductor die to the second bumps of the substrate while the semiconductor die are disposed over the carrier.

A method of making a semiconductor device, comprising:

• providing a carrier;
• mounting a plurality of semiconductor die to the carrier;
• forming an electrical interconnect over a surface of the semiconductor die opposite the carrier;
• and
• disposing a substrate panel over the surface of semiconductor die opposite the carrier after mounting the semiconductor die to the carrier.