Resin-encapsulated semiconductor device and its manufacturing method

A resin-sealed semiconductor device comprising:

• a semiconductor chip including a silicon substrate;
• a die pad on which the semiconductor chip is secured;
• a sealing resin layer sealing the semiconductor chip;
• and
• a plurality of lead terminals connected electrically with the semiconductor chip, one end portion of the plurality of lead terminals being covered by the sealing resin layer,
• wherein a part of the plurality of lead terminals covered by the sealing resin layer is arranged at a position higher than the die pad,
• wherein the die pad has a curved side surface so as to have a gradually varying thickness,
• wherein the die pad has a plan area larger than a plan area of the semiconductor chip,
• wherein, in the die pad, only in a predetermined region other than a region in which the semiconductor chip is arranged, an open part that penetrates from one main surface side to the other main surface side of the die pad is provided,
• wherein the open part is in a vicinity of the semiconductor chip, and
• wherein a thermal expansion coefficient of at least one of the semiconductor chip, the die pad, or the lead terminals facilitates removal of moisture near the semiconductor chip and reduces likelihood of moisture reaching the semiconductor chip.

A resin-sealed semiconductor device comprising:

• a semiconductor chip including a silicon substrate;
• a die pad on which the semiconductor chip is secured;
• a sealing resin layer sealing the semiconductor chip;
• and
• a plurality of lead terminals connected electrically with the semiconductor chip, one end portion of the plurality of lead terminals being covered by the sealing resin layer,
• wherein a part of the plurality of lead terminals covered by the sealing resin layer is arranged at a position higher than the die pad,
• wherein the die pad has a plan area larger than a plan area of the semiconductor chip,
• wherein, in the die pad, only in a predetermined region other than a region in which the semiconductor chip is arranged, an open part that penetrates from one main surface side to the other main surface side of the die pad is provided,
• wherein outer edges of the open part along a longer-side direction thereof are formed of two sides extending continuously in a direction along an edge line of the semiconductor chip, and
• wherein the open part is in a vicinity of the semiconductor chip, and
• wherein a thermal expansion coefficient of at least one of the semiconductor chip, the die pad, or the lead terminals facilitates removal of moisture near the semiconductor chip and reduces likelihood of moisture reaching the semiconductor chip.