Semiconductor device
AssigneeMitsubishi Electric Corporation
InventorsHiroki Shiota, Seiji Oka, Yoshihiro Yamaguchi
Life of this patent
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Abstract
A semiconductor device including: a semiconductor element; a lead frame connected to the semiconductor element; a metal base plate mounted on the lead frame via a first insulation layer; and a second insulation layer disposed on the opposite side of the metal base plate face on which the first insulation layer is disposed; wherein the first insulation layer is an insulation layer whose heat-dissipation performance is higher than that of the second insulation layer, and the second insulation layer is an insulation layer whose insulation performance is the same as that of the first insulation layer or higher than that of the first insulation layer.
Claims14
A semiconductor device, comprising:
- a semiconductor element;
- a lead frame connected to the semiconductor element;
- a metal base plate mounted on the lead frame via a first insulation layer, a face of the metal base plate and the first insulation layer facing each other;
- a second insulation layer disposed on a side of the metal base plate face opposite the first insulation layer;
- and
- a cooling unit, directly connected to a side of the metal base plate, disposed on the second insulation layer on a side of the second insulation layer which faces the metal base plate, the side of the metal base plate being perpendicular to the face of the metal base plate.
Dependencies are inferred from the claim text.