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US 9,287,200 B2Granted
Packaged semiconductor device
AssigneeFreescale Semiconductor, Inc.
InventorLeo M. Higgins, III
Life of this patent
Estimating the term…
Abstract
A packaged semiconductor device includes a lead frame having a plurality of leads; a semiconductor die mounted onto the lead frame; and an encapsulant surrounding the semiconductor die. At least a portion of each of the leads is surrounded by the encapsulant, wherein, each lead includes a thin portion external to the encapsulant and a thick portion that is surrounded by the encapsulant, wherein the thin portion is thinner than the thick portion.
Claims16
A packaged semiconductor device, comprising:
- a lead frame having a plurality of leads;
- a semiconductor die mounted onto the lead frame;
- an encapsulant surrounding the semiconductor die, wherein at least a portion of each of the leads is surrounded by the encapsulant, wherein, each lead comprises a knee region of the lead extending external to the encapsulant that is a thin portion and a first thick portion that is surrounded partially by and extends external to the encapsulant and a second thick portion that is a foot portion of the lead, wherein the thin portion is thinner than the first and second thick portions and the thin portion is between the first and second thick portions;
- and
- a bend in a heel/ankle region of the second thick portion adjacent to the foot portion.
2 more elements
A method for forming a packaged semiconductor device, comprising:
- attaching a semiconductor die to a lead frame having a plurality of leads to form a lead frame assembly;
- encapsulating the lead frame assembly with an encapsulant, wherein the encapsulant surrounds the semiconductor die and at least a portion of each lead of the plurality of leads, wherein each of the plurality of leads comprises a thin portion external to the encapsulant, a first thick portion at one end of the lead that is surrounded partially by and extends from the encapsulant, and a second thick portion at an opposite end of the lead that forms a foot portion, wherein the thin portion is thinner than the first and second thick portions and is between the first and second thick portions;
- and
- forming a bend in a heel/ankle region of the second thick portion, wherein the bend is greater than zero and less than 90 degrees with respect to vertical.
1 more element
Dependencies are inferred from the claim text.