Stub minimization using duplicate sets of terminals having modulo-x symmetry for wirebond assemblies without windows

A microelectronic package, comprising:

• a substrate having first and second opposed surfaces, the first surface having substrate contacts thereon;
• two or more microelectronic elements each embodying a greater number of active devices to provide memory storage array function than any other function, each of the microelectronic elements having a rear face facing the first surface, a front face opposite the rear face, and contacts on the front face electrically connected with the substrate contacts through conductive structure extending above the front face;
• a plurality of terminals at the second surface configured for connecting the microelectronic package with at least one component external to the package, the terminals electrically coupled with the substrate contacts and including first and second groups of data terminals, each of the first and second groups having at least eight data terminals disposed on first and second opposite sides of an axis, respectively,
• wherein each of the data terminals of the first and second groups are configured to carry data signals for read and write access to random access addressable memory locations of a memory storage array within the microelectronic elements, and the data terminals of the first group have modulo-8 symmetry about the axis with the second group of the data terminals.

A microelectronic package, comprising:

• a substrate having first and second opposed surfaces, the first surface having substrate contacts thereon;
• first, second, third, and fourth microelectronic elements, each embodying a greater number of active devices to provide memory storage array function than any other function, each microelectronic element having a rear face facing the first surface, a front face opposite the rear face, and contacts on the front face electrically connected with the substrate contacts through conductive structure extending above the respective front face;
• a plurality of terminals at the second surface configured for connecting the microelectronic package with at least one component external to the package, the terminals electrically coupled with the substrate contacts and including first and second groups of data terminals, each of the first and second groups having at least eight data terminals disposed on first and second opposite sides of an axis, respectively,
• wherein each of the data terminals of the first and second groups are configured to carry data signals for read and write access to random access addressable memory locations of a memory storage array within the microelectronic element, and the data terminals of the first group have modulo-X symmetry about the axis with the second group of the data terminals, wherein X is a whole number greater than 2.