Devices employing semiconductor die having hydrophobic coatings, and related cooling methods

An electrical assembly, comprising:

• at least one semiconductor die generating heat;
• at least one substrate electrically coupled to an electrical source;
• at least one electrical contact element conductively connecting the substrate and the at least one semiconductor die;
• and
• a hydrophobic coating disposed on the at least one semiconductor die, at least one substrate, and at least one electrical contact element,
• wherein the hydrophobic coating is configured to form an effective contact angle with a water droplet of more than one-hundred fifty (150) degrees, and
• wherein the hydrophobic coating includes an inner surface in direct thermal conductive communication with the semiconductor die and an outer surface transferring heat through direct convective heat transfer to a cooling fluid.

An electrical assembly, comprising:

• a substrate configured to interface with an electrical source;
• a plurality of semiconductor die, including a first semiconductor die and a second semiconductor die, wherein the plurality of semiconductor die and the substrate are in a stacked arrangement to form a 3D chip stack, and the first semiconductor die is disposed between the second semiconductor die and the substrate, and;
• at least one electrical contact element conductively connecting the first semiconductor die to the substrate and the second semiconductor die to at least one TSV (through silicon via) of the first semiconductor die;
• a hydrophobic coating attached to each of the plurality of semiconductor die, substrate, and electrical contact element, wherein the hydrophobic coating is configured to form an effective contact angle with a water droplet of more than one-hundred fifty (150) degrees;
• and
• an enclosure secured to the substrate and forming a chamber containing the plurality of semiconductor die, and the enclosure includes an inlet port and an outlet port configured for a cooling fluid to respectively enter and depart from the chamber,
• wherein the hydrophobic coating includes an inner surface in direct conductive thermal communication with the semiconductor die and an outer surface arranged for direct convective thermal communication with the cooling fluid.