Apparatuses and methods for die seal crack detection
AssigneeMicron Technology, Inc.
InventorsCharles H. Dennison, Kenneth W. Marr, Deepak Thimmegowda, Philip J. Ireland
Life of this patent
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Abstract
Apparatuses and methods can include a die seal between an integrated circuit region of a die and a periphery of the die. A via chain(s) may be arranged around an inner circumference of the die seal between the die seal and the integrated circuit region and/or around an outer circumference of the die seal between the die seal and the periphery of the die. The via chain may include a plurality of contacts comprised of conductive material and extending through portions of the die. Circuitry may be coupled to an end of the via chain to detect an electrical signal. Additional apparatuses and methods are described.
Claims9
An apparatus comprising:
- a die seal between an integrated circuit region of a die and a periphery of the die;
- a via chain arranged around a circumference of the die seal, the via chain including a plurality of contacts extending through portions of the die, wherein the via chain being arranged around a circumference of the die seal comprises a first via chain being arranged around an inner circumference of the die seal between the die seal and the integrated circuit region, and a second via chain being arranged around an outer circumference of the die seal between the die seal and the periphery of the die;
- and
- a pad surrounded by the die seal, and coupled to an end of the second via chain,
- wherein the die seal comprises a gap to route a lead for coupling the pad to the end of the second via chain.
Dependencies are inferred from the claim text.