Multi-gate field effect transistor (FET) including isolated fin body
AssigneeGlobalfoundries Inc.
InventorsHongmei Li, Junjun Li
Life of this patent
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Abstract
Aspects of the disclosure provide a multi-gate field effect transistor (FET) formed on a bulk substrate that includes an isolated fin and methods of forming the same. In one embodiment, the multi-gate FET includes: a plurality of silicon fin structures formed on the bulk substrate, each silicon fin structure including a body region, a source region, and a drain region; wherein a bottom portion the body region of each silicon fin structure includes a tipped shape to isolate the body region from the bulk substrate, and wherein the plurality of silicon fin structures are attached to the bulk substrate via at least a portion of the source region, or at least a portion of the drain region, or both.
Claims14
A method of fabricating a multi-gate field effect transistor (FET) in a bulk substrate manufacturing process, the method comprising:
- forming a plurality of silicon fin structures on a bulk substrate;
- depositing an oxide layer on the bulk substrate;
- removing a portion of the oxide layer, such that a first sidewall portion of each silicon fin structure is exposed;
- depositing a nitride spacer along the first exposed sidewall portion of each silicon fin structure;
- removing a remaining portion of the oxide layer, such that a second sidewall portion of each silicon fin structure below the nitride spacer is exposed;
- performing a plurality of etches, such that a bottom portion of a body region of each silicon fin structure includes a tipped shape;
- and
- depositing an oxide between the body region of each silicon fin structure and the bulk substrate to isolate the body region of each silicon fin structure from the bulk substrate;
- wherein a portion of the bulk substrate between each silicon fin structure includes a tipped shape;
- wherein performing the plurality of etches comprises:
- performing an angled deep reactive ion etching to a portion of the second sidewall portion of each silicon fin structure;
- and
- performing an anisotropic dry etch to form the tipped shape of the bottom portion of the body region of each silicon fin structure and to form the tipped shape of the portion of the bulk substrate between each silicon fin structure.
A method of fabricating a multi-gate field effect transistor (FET) in a bulk substrate manufacturing process, the method comprising:
- forming a plurality of silicon fin structures on a bulk substrate;
- depositing an oxide layer on the bulk substrate;
- removing a portion of the oxide layer, such that a first sidewall portion of each silicon fin structure is exposed;
- depositing a nitride spacer along the first exposed sidewall portion of each silicon fin structure;
- removing a remaining portion of the oxide layer, such that a second sidewalk portion of each silicon fin structure below the nitride spacer is exposed;
- performing an isotropic reactive ion etching to etch a curved portion of the second sidewall portion of each silicon fin structure;
- performing a sigma silicon wet etch, such that a bottom portion of a body region of each silicon fin structure includes a tipped shape and a portion of the bulk substrate directly below the body region of each silicon fin structure includes a corresponding tipped shape;
- and
- depositing an oxide between the body region of each silicon fin structure and the bulk substrate to isolate the body region of each silicon fin structure from the bulk substrate.
A method of fabricating a multi-gate field effect transistor (FET) in a bulk substrate manufacturing process, the method comprising:
- forming a plurality of silicon fin structures on a bulk substrate;
- depositing an oxide layer on the bulk substrate;
- removing a portion of the oxide layer, such that a first sidewall portion of each silicon fin structure is exposed;
- depositing a nitride spacer along the first exposed sidewall portion of each silicon fin structure;
- removing a remaining portion of the oxide layer, such that a second sidewall portion of each silicon fin structure below the nitride spacer is exposed;
- performing a plurality of etches, such that a bottom portion of a body region of each silicon fin structure includes a tipped shape;
- and
- depositing an oxide between the body region of each silicon fin structure and the bulk substrate to isolate the body region of each silicon fin structure from the bulk substrate;
- wherein the performing a plurality of etches comprises:
- performing an angled deep reactive ion etching on the second sidewall portion of each silicon fin structure;
- and
- performing an anisotropic dry etch, such that the bottom portion of the body region of each silicon fin structure includes a tipped shape and a portion of the bulk substrate between each silicon fin structure includes a tipped shape.
Dependencies are inferred from the claim text.