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US 9,287,172 B2Granted
Interposer-on-glass package method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Jing-Cheng Lin
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Abstract
A method comprises providing an interposer comprising a substrate and a first through-substrate via (TSV) penetrating through the substrate, forming a first oxide layer on a surface of the interposer, bonding a glass substrate to the interposer through a fusion bonding, with the first oxide layer being between the interposer and the glass substrate and forming a second TSV in the glass substrate and electrically coupled to the first TSV.
Claims20
A method comprising:
- providing an interposer comprising:
- a substrate;
- and
- a first through-substrate via (TSV) penetrating through the substrate;
- forming a first oxide layer on a surface of the interposer;
- bonding a glass substrate to the interposer through a fusion bonding, with the first oxide layer being between the interposer and the glass substrate;
- and
- forming a second TSV in the glass substrate and electrically coupled to the first TSV.
5 more elements
A method comprising:
- depositing a first etch stop layer on a first side of an interposer, wherein the interposer comprises a substrate and a first through-substrate via (TSV) penetrating through the substrate;
- depositing a second etch stop layer on the first etch stop layer;
- depositing a first oxide layer on the second etch stop layer;
- bonding a glass substrate to the interposer through a fusion bonding, wherein the first oxide layer is between the interposer and the glass substrate;
- and
- forming a second TSV in the glass substrate and electrically coupled to the first TSV.
3 more elements
A method comprising:
- depositing a first etch stop layer on a first side of an interposer, wherein the interposer comprises a substrate and a first through-substrate via (TSV);
- depositing a first oxide layer over the first etch stop layer;
- bonding a glass substrate to the interposer through a fusion bonding, wherein the first oxide layer is between the interposer and the glass substrate;
- forming a second TSV in the glass substrate and electrically coupled to the first TSV;
- and
- mounting a plurality of bumps on a non-bonding side of the glass substrate.
3 more elements
Dependencies are inferred from the claim text.