Semiconductor element for package miniaturization

A semiconductor element, comprising:

• a first patterned conductive layer having a first surface and a second surface opposite the first surface;
• a second patterned conductive layer having a first surface and a second surface opposite the first surface, wherein the first surface of the second patterned conductive layer is connected to the second surface of the first patterned conductive layer;
• and
• an insulating layer having a first surface and a second surface opposite the first surface and comprising at least one space on the second surface thereof, wherein the first patterned conductive layer and the second patterned conductive layer are embedded in the insulating layer between the first surface and the second surface of the insulating layer, the first surface of the first patterned conductive layer is entirely exposed on the first surface thereof, the second surface of the second patterned conductive layer is entirely exposed on the second surface of the insulating layer, and the space extends entirely through the insulating layer so as to connect the first surface to the second surface thereof.