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US 9,287,126 B2Granted
Multi-wafer pair anodic bonding apparatus and method
AssigneeHewlett-Packard Development Company, L.P.
InventorsChien-Hua Chen, Kianush Naeli, Stephen R. Farrar
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Abstract
An electric field concurrently anodically bonds together wafers of each of a plurality of independent wafer pairs.
Claims11
A method comprising:
- heating a stack of independent wafer pairs comprising a first wafer pair and a second wafer pair, wherein the first wafer pair and the second wafer pair are immediately consecutive in the stack and in a back to back arrangement;
- and
- creating a first electric field in a first direction across a first junction of the first wafer pair;
- and
- creating a second electric field in a second direction opposite the first direction across a second junction of the second wafer pair to concurrently anodically bond the first wafer pair at the first junction and the second wafer pair at the second junction without bonding the first wafer pair to the second wafer pair.
2 more elements
A method comprising:
- electrically grounding a first chuck and a second chuck;
- positioning independent wafer pairs between the first chuck and the second chuck with immediately consecutive wafer pairs in a back-to-back arrangement;
- heating the independent wafer pairs;
- applying a voltage to a wafer of one of the independent wafer pairs.
1 more element
Dependencies are inferred from the claim text.