Printed wiring board, inductor component, and method for manufacturing inductor component

An inductor component, comprising:

• a support layer;
• a first conductive pattern formed on the support layer;
• an interlayer insulation layer formed on the support layer and the first conductive pattern;
• a second conductive pattern formed on the interlayer insulation layer;
• and
• a via conductor formed in the interlayer insulation layer and connecting the first conductive pattern and the second conductive pattern,
• wherein the interlayer insulation layer includes a magnetic layer and a resin layer covering the magnetic layer, the magnetic layer of the interlayer insulation layer includes a magnetic material and a resin material and has a first penetrating hole, the interlayer insulation layer has a second penetrating hole penetrating through the resin layer such that the second penetrating hole passes through the first penetrating hole and extends to the first conductive pattern, and the via conductor is formed in the second penetrating hole such that the via conductor is not in contact with the magnetic layer of the interlayer insulation layer.

A method for manufacturing an inductor component, comprising:

• forming a support layer on a support substrate;
• forming a first conductive pattern on the support layer;
• forming on the support layer and the first conductive pattern a magnetic layer comprising a magnetic material and a resin material and having a first penetrating hole penetrating through the magnetic layer such that the first penetrating hole extends to the first conductive pattern;
• forming a resin layer on the magnetic layer such that the resin layer covers the magnetic layer, that the resin layer fills the first penetrating hole formed in the magnetic layer and that an interlayer insulation layer comprising the magnetic layer and the resin layer is formed on the support layer;
• forming a second penetrating hole penetrating through the resin layer such that the second penetrating hole passes through the first penetrating hole in the magnetic layer and extends to the first conductive pattern;
• forming a second conductive pattern on the resin layer of the interlayer insulation layer;
• forming a via conductor in the second penetrating hole such that the via conductor connects the first conductive pattern and the second conductive pattern and that the via conductor is not in contact with the magnetic layer of the interlayer insulation layer;
• and
• removing the support substrate from the support layer.