Multi-chip non-volatile semiconductor memory package including heater and sensor elements
OwnerDarryl G. Walkerinventor
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Abstract
A method of healing a plurality of non-volatile semiconductor memory devices on a multi-chip package is disclosed. The multi-chip package can be heated to a temperature range having a temperature range upper limit value and a temperature range lower limit value. The temperature of the multi-chip package can be kept essentially within the temperature range for a predetermined time period by monitoring a thermal sensing element with a sensing circuit outside of the multi-chip package. The thermal sensing element may be located near the components with the lowest failure temperature to ensure the multi-chip package is not damaged during the healing process.
Claims20
A system, comprising:
- a chip package including
- a first semiconductor device;
- a thermal sensing element having a first thermal sensing element terminal and a second thermal sensing element terminal;
- a plurality of connections formed on the bottom surface of the package wherein a first one of the plurality of connections is electrically connected to the first thermal sensing element terminal and a second one of the plurality of connections is electrically connected to the second thermal sensing element;
- and
- a sensor circuit having a first sense node coupled to the first one of the plurality of connections and a second sense node coupled to the second one of the plurality of connections wherein
- the sensor circuit is coupled to receive a sensor enable signal and provide a temperature range upper limit detect signal having a logic level determined by the temperature of the thermal sensing element when the sensor enable signal has an enable logic level wherein
- the sensor circuit includes a first amplifier circuit, the first amplifier circuit having a first input terminal coupled to the second sense node, the first amplifier circuit is coupled to provide the temperature range upper limit detect signal at a first amplifier circuit output terminal.
Dependencies are inferred from the claim text.