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US 9,286,956 B2Granted
Memory device, memory module including the memory device, method of fabricating the memory module, and method of repairing the memory module
AssigneeSamsung Electronics Co., Ltd.
InventorsDan-Kyu Kang, Sang-Seok Kang, Young-Man Ahn
Life of this patent
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Abstract
A memory module is provided. A plurality of DRAMs is mounted on a PCB. At least one DRAM has an operating parameter different from other DRAMs according to a position where the at least one DRAM is mounted on the PCB.
Claims11
A memory module, comprising:
- a register disposed at a center region of the memory module;
- a first DRAM disposed at a first distance from the register, wherein the first DRAM operates at a first operating parameter;
- and
- a second DRAM disposed at a second distance from the register, wherein the second DRAM operates at a second operating parameter,
- wherein the first operating parameter is different from the second operating parameter, and
- wherein the first operating parameter and the second operating parameter are set according to respective positions of the first DRAM and the second DRAM from the register.
3 more elements
A memory module, comprising:
- a register disposed at a center region of the memory module;
- a first DRAM disposed at a first distance from the register, wherein the first DRAM operates at a first operating parameter;
- and
- a second DRAM disposed at a second distance from the register, wherein the second DRAM operates at a second operating parameter,
- a third DRAM disposed at a third distance from the register, wherein the third DRAM operates at a third operating parameter,
- wherein the first operating parameter is different from the second operating parameter, and wherein the first distance is substantially equal to the third distance and the first operating parameter is substantially equal to the third operating parameter.
3 more elements
Dependencies are inferred from the claim text.