Iterative defect filtering process
AssigneeApplied Materials Israel Ltd.
InventorsSaar Shabtay, Idan Kaizerman, Amir Wachs
Life of this patent
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AssigneeApplied Materials Israel Ltd.
InventorsSaar Shabtay, Idan Kaizerman, Amir Wachs
Estimating the term…
A method for classifying defects of a wafer, the method is executed by a computerized system, the method may include obtaining defect candidate information about a group of defect candidates, wherein the defect candidate information comprises values of attributes per each defect candidate of the group; selecting, by a processor of the computerized system, a selected sub-group of defect candidates in response to values of attributes of defect candidates that belong to at least the selected sub-group; classifying defect candidates of the selected sub-group to provide selected sub-group classification results; repeating, until fulfilling a stop condition: selecting an additional selected sub-group of defect candidates in response to (a) values of attributes of defect candidates that belong to at least the additional selected sub-group; and (b) classification results obtained from classifying at least one other selected sub-group; and classifying defect candidates of the additional selected sub-group to provide additional selected sub-group classification results.
A method for classifying defects of a wafer, the method is executed by a computerized system, the method comprises:
A non-transitory computer readable storage medium having instructions that, when executed by a processing device of a computerized system, cause the processing device to perform operations comprising:
Dependencies are inferred from the claim text.