Apparatuses and methods for printed radio frequency identification (RFID) tags

A radio frequency identification (RFID) tag assembly, comprising:

• a substrate including a top surface;
• a receiving layer comprising a plurality of RFID antenna receiving pads in a pre-determined layout located on the top surface of the substrate, wherein each receiving pad of the plurality of receiving pads is an electrical insulator;
• a chip located on the top surface of the substrate;
• and
• an RFID antenna having an entire length, wherein:
• the RFID antenna comprises a bond wire having a first end attached to a first receiving pad of the plurality of receiving pads, a second end attached to the chip, and an intermediate location between the first end and the second end, wherein the intermediate location is attached to a second receiving pad of the plurality of receiving pads;
• the pre-determined layout of the plurality of receiving pads provides a shape of the antenna;
• and
• a majority of the entire length of the RFID antenna comprises one or more bond wires attached to the plurality of RFID antenna receiving pads and to the chip.

A chipless radio frequency identification (RFID) tag assembly, comprising:

• a substrate including a top surface;
• a receiving layer, comprising a plurality of RFID antenna receiving pads located on the top surface of the substrate, wherein each receiving pad of the plurality of receiving pads is an electrical insulator;
• and
• an RFID antenna, wherein:
• the RFID antenna comprises a first end attached to one of the plurality of RFID antenna receiving pads, a second end opposite the first end, and an intermediate location between the first end and the second end, wherein the intermediate location is attached to a second receiving pad of the plurality of receiving pads;
• a majority of an entire length of the RFID antenna is provided by at least one bond wire;
• and
• the at least one bond wire is one of a copper bond wire, an aluminum bond wire, a palladium-covered copper bond wire, and an aluminum-covered copper bond wire.