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US 9,286,435 B2Granted
System and methods for OPC model accuracy management and disposition
AssigneeGlobalfoundries Singapore Pte. Ltd.
InventorsYong Wah Jacky Cheng, Andrew Ker Ching Khoh, Yee Mei Foong, Gek Soon Chua
Life of this patent
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Abstract
System and methods for OPC model accuracy and disposition using quad matrix are presented. A method includes obtaining wafer data from a calibration test pattern. The method also classifies the wafer data into four quadrants of a quad matrix. The method further utilizes at least one of the four quadrants to quantify OPC model accuracy.
Claims20
A method comprising:
- employing a computer for quantifying optical proximity correction (OPC) model accuracy by performing operations comprising
- selecting an OPC model at least by performing quad matrix management which comprises
- obtaining wafer data from a calibration test pattern,
- classifying the same wafer data obtained from the calibration test pattern into four quadrants of a quad matrix, and
- utilizing one of the four quadrants to quantify OPC model accuracy;
- creating a photomask based at least in part on the selected OPC model after performing the quad matrix management;
- performing wafer verification;
- and
- verifying lithography performance.
6 more elements
A method comprising:
- quantifying optical proximity correction (OPC) model accuracy by performing operations comprising
- selecting an OPC model at least by performing quad matrix management which comprises
- obtaining wafer data from a calibration test pattern,
- classifying the same wafer data obtained from the calibration test pattern into four quadrants of a quad matrix, and
- utilizing one of the four quadrants to quantify OPC model accuracy;
- creating a photomask based at least in part on the selected OPC model after performing the quad matrix management;
- performing wafer verification;
- and
- verifying lithography performance, wherein when the lithography performance is acceptable, the OPC model is qualified for full chip production.
6 more elements
A system comprising:
- a processing unit;
- and
- a system memory, wherein the system memory comprises a program module configured to quantify optical proximity correction (OPC) model accuracy, the program module
- selects an OPC model at least by performing quad matrix management which comprises
- obtaining wafer data from a calibration test pattern,
- classifying the same wafer data obtained from the calibration test pattern into four quadrants of a quad matrix, and
- utilizing one of the four quadrants to quantify OPC model accuracy;
- creates a photomask based at least in part on the selected OPC model after performing the quad matrix management;
- performs wafer verification;
- and
- verifies lithography performance.
8 more elements
Dependencies are inferred from the claim text.