3DIC memory chips including computational logic-in-memory for performing accelerated data processing

A data processing method, comprising:

• storing data in primary memory provided by at least one memory layer;
• loading one or more data subsets of the data from the primary memory into a computational logic-in-memory (LiM) layer over a plurality of vertical interconnect access structures (VIAs);
• processing the one or more data subsets of the data computationally within the computational LiM layer;
• and
• storing a computational result.

A method of constructing a three-dimensional (3D) integrated circuit (3DIC) memory chip, comprising:

• forming at least one memory layer comprising a primary memory configured to store data;
• forming a plurality of vertical interconnect access structures (VIAs) interconnected with the primary memory;
• and
• forming a computational logic-in-memory (LiM) layer comprising at least one LiM block such that the at least one LiM block comprises:
• local memory interconnected with functional logic units to process the data from the primary memory that is accessed through the VIAs;
• wherein the functional logic units are configured to:
• load one or more data subsets of the data from the primary memory over the VIAs into the local memory;
• access the one or more data subsets loaded into the local memory;
• computationally process the one or more data subsets accessed from the local memory to generate a computational result;
• and
• store the computational result in the local memory.