Touch stack-up structure
AssigneeTPK Touch Solutions (Xiamen) Inc.
InventorsLichun Yang, Mingyuan Hong, Chunyong Zhang, Congming Chen
Life of this patent
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Abstract
The present disclosure provides a touch stack-up structure, which can be applied in a touch panel to make the panel have excellent appearance and reliability. An embodiment of the present disclosure provides a touch stack-up structure that comprises sequentially forming a patterned transparent conductive layer, a first transparent insulation layer with low refractive index, a second transparent insulation layer with high refractive index, and an optical clear adhesive on a transparent substrate.
Claims14
A touch stack-up structure comprising:
- a conductive layer;
- a first refractive index layer that covers the conductive layer;
- a second refractive index layer located on the first refractive index layer, wherein a refractive index of the first refractive index layer is lower than the refractive index of the conductive layer, and wherein the refractive index of the second refractive index layer is higher than the refractive index of the first refractive index layer, wherein the first refractive index layer with a lower refractive index than the second refractive index layer is located between the conductive layer and the second refractive index layer;
- a third refractive index layer directly located on the second refractive index layer, wherein the refractive index of the third refractive index layer is lower than the refractive index of the second refractive index layer;
- and
- a covering layer located on the third refractive index layer;
- wherein the third refractive index layer has a first part and a second part, the first part and the second part have different cross-linking densities, wherein the first part is applicable for lamination with the covering layer made of glass and the second part is applicable for lamination with the second refractive index layer made of niobium pentoxide (Nb2O5) or silicon nitride (SiNX).
A method of forming a touch stack-up structure on a substrate, comprising the steps of:
- forming a conductive layer on said substrate;
- depositing a first refractive index layer to cover said conductive layer, wherein refractive index of said first refractive index layer is lower than refractive index of said conductive layer;
- depositing a second refractive index layer to cover said first refractive index layer, wherein refractive index of said second refractive index layer is higher than refractive index of said first refractive index layer;
- depositing a third refractive index layer directly on the second refractive index layer, wherein the refractive index of the third refractive index layer is lower than the refractive index of the second refractive index layer;
- and
- depositing a covering layer on the third refractive index layer;
- wherein the third refractive index layer has a first part and a second part, the first part and the second part have different cross-linking densities, wherein the first part is applicable for lamination with the covering layer made of glass and the second part is applicable for lamination with the second refractive index layer made of niobium pentoxide (Nb2O5) or silicon nitride (SiNX).
Dependencies are inferred from the claim text.