Photosensitive resin composition and uses thereof

A photosensitive resin composition comprising:

• an alkali-soluble resin (A);
• wherein the alkali-soluble resin (A) comprises a resin having an unsaturated group (A-1) synthesized by reacting a mixture, and the mixture comprises an epoxy compound having at least two epoxy groups (i) and a compound having at least one carboxyl group and at least one vinyl unsaturated group (ii);
• wherein the alkali-soluble resin (A) further comprises an other alkali-soluble resin (A-2), and the other alkali-soluble resin (A-2) is polymerized with an unsaturated carboxylic acid or unsaturated carboxylic acid anhydride compound (a1), an unsaturated compound containing an epoxy group (a2), and an other unsaturated compound (a3), wherein the unsaturated compound containing an epoxy group (a2) is at least one selected from the group consisting of (meth)acrylate compound containing an epoxy group, α-alkyl acrylate compound containing an epoxy group, and epoxypropyl ether;
• wherein the used amount of the other alkali-soluble resin (A-2) is from 30 to 70 parts by weight based on 100 parts by weight of the used amount of the alkali-soluble resin (A);
• a compound having an ethylenically unsaturated group (B);
• a photoinitiator (C);
• a solvent (D);
• and
• an organic acid (E);
• wherein a molecular weight of said organic acid (E) is below 1000.