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US 9,285,555 B2Granted
Optical circuit board
OwnerGnitabouré Yabreinventor
Life of this patent
Estimating the term…
Abstract
An optical circuit board including a top face, a bottom face, an optical layer buried between bottom and top faces, the optical layer being adapted to transmit optical signals, an opto-electronic component adapted to emit or receive light transmitted through the optical layer, a solid heat dissipative element adapted to dissipate heat generated at the opto-electronic component.
Claims19
An optical circuit board comprising:
- a top face,
- a bottom face,
- an optical layer buried between said bottom and top faces, said optical layer being adapted to transmit optical signals,
- an opto-electronic component adapted to emit or receive light transmitted through said optical layer,
- a solid heat dissipative element adapted to dissipate heat, generated at the opto-electronic component, and
- a cavity extending between the top and bottom faces, wherein the solid heat dissipative element is mounted in the cavity from the bottom face.
3 more elements
An optical circuit board having a body comprising:
- a top face,
- a bottom face,
- an optical layer buried between said bottom and top faces, said optical layer being adapted to transmit optical signals,
- an optical engine fixed to the body and comprising:
- a heat-dissipating printed circuit board substrate made of ceramics,
- an opto-electronic component carried by the substrate and adapted to emit or receive light transmitted through said optical layer,
- a control component carried by the substrate, electrically connected to the optoelectronic component on the substrate,
- a solid heat sink fixed to the heat-dissipating printed circuit board substrate and adapted to dissipate heat generated at the opto-electronic component, and
- a cavity extending between the top and bottom faces, wherein the solid heat sink is mounted in the cavity from the bottom face.
6 more elements
An optical circuit board comprising:
- a top face,
- a bottom face,
- a cavity extending between the top and the bottom faces,
- an optical layer buried between said bottom and top faces, said optical layer being adapted to transmit optical signals,
- an opto-electronic component adapted to emit or receive light transmitted through said optical layer,
- a solid heat dissipative element adapted to dissipate heat generated at the opto-electronic component, mounted in the cavity from the bottom face, wherein the solid heat dissipative element is mounted in the cavity from the bottom face, and
- a cover mounted to the top face adapted to seal the cavity.
4 more elements
An optical circuit board comprising:
- a top face,
- a bottom face,
- an optical layer buried between said bottom and top faces, said optical layer being adapted to transmit optical signals,
- an opto-electronic component adapted to emit or receive light transmitted through said optical layer,
- a solid heat dissipative element adapted to dissipate heat generated at the opto-electronic component,
- an optical coupling device adapted to optically couple the opto-electronic component to the buried optical layer, and
- a cavity extending between the top and bottom faces, wherein the solid heat dissipative element is mounted in the cavity from the bottom face,
- wherein the optical coupling device comprises a mirror adapted to deflect light between the opto-electronic component and the buried optical layer, wherein the optical coupling device comprises a light-beam forming structure adapted to optically couple the opto-electronic component to the buried optical layer.
5 more elements
Dependencies are inferred from the claim text.