Semiconductor device and system
AssigneeKabushiki Kaisha Toshiba
InventorDaisuke Nakata
Life of this patent
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Abstract
According to one embodiment, there is provided a semiconductor device including a package, a semiconductor chip, and a capacitor. The semiconductor chip has an electrode. The semiconductor chip is implemented in the package. The capacitor is implemented in the package. One terminal of the capacitor is electrically connected to the electrode of the semiconductor chip. Another terminal of the capacitor is electrically connected to a ground terminal of the package. The semiconductor chip includes a capacitance measurement circuit. The capacitance measurement circuit measures a level of capacitance of the capacitor via the electrode of the semiconductor chip.
Claims6
A semiconductor device comprising:
- a package;
- a semiconductor chip which has an electrode and is implemented in the package;
- and
- a capacitor which is implemented in the package, one terminal of the capacitor being electrically connected to the electrode of the semiconductor chip, another terminal of the capacitor being electrically connected to a ground terminal of the package,
- the semiconductor chip including a capacitance measurement circuit which measures a level of capacitance of the capacitor via the electrode of the semiconductor chip,
- the capacitor measurement circuit including:
- a variable resistance;
- and
- a switch which makes a loop circuit including the capacitor and the variable resistance closed when discharging charges stored in the capacitor, and which makes the loop circuit including the capacitor and the variable resistance open when recharging charges in the capacitor.
Dependencies are inferred from the claim text.