System and methods for thermal control using sensors on die
AssigneeApple Inc.
InventorsAmaury J. Heresztyn, Ihtesham H. Chowdhury, Keith Cox
Life of this patent
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Abstract
A portable electronic device including a temperature sensor embedded in a die is provided. To process temperature measurements the portable electronic device includes a processor circuit coupled to the temperature sensor, the processor circuit configured to read a measurement from the temperature sensor when an integrated circuit in the die is inactive. Furthermore, a memory circuit coupled to the processor circuit and the temperature sensor stores a temperature gradient provided by the temperature sensor. A Printed Circuit Board for use in a portable electronic device as above is also provided. A method for performing thermal control in a portable electronic device as above is also provided.
Claims12
A Printed Circuit Board (PCB) in communication with a processor circuit and configured to determine a representative temperature of the PCB, the PCB comprising:
- a first temperature sensor embedded within a first integrated circuit (IC) directly measuring a first temperature of the first integrated circuit (IC);
- a second temperature sensor embedded within a second integrated circuit (IC) directly measuring a second temperature of the second IC;
- a component;
- and
- wherein the processor circuit is configured to:
- receive the first temperature and the second temperature,
- run a simulation program stored on a memory circuit to establish a temperature gradient, based upon the first temperature and the second temperature, across the PCB, and
- perform a remedial action to the component based upon the temperature gradient.
A portable electronic device configured to perform a remedial action in response to a thermal flux within the portable electronic device, the portable electronic device comprising:
- a printed circuit board (PCB);
- a temperature sensor embedded within an IC disposed on the PCB and that directly measures a temperature of the first IC;
- a processor circuit that receives multiple temperature readings of the PCB from the temperature sensor embedded within the IC to establish a simulated temperature gradient across the PCB based upon the multiple temperature readings;
- a memory circuit that sends to the processor circuit a simulation program to establish the simulated temperature gradient;
- and
- a component disposed on the PCB, the component receiving the remedial action based upon the simulated temperature gradient.
Dependencies are inferred from the claim text.