Sloped structure, method for manufacturing sloped structure, and spectrum sensor
AssigneeSeiko Epson Corporation
InventorTakahiko Yoshizawa
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Abstract
A method for manufacturing a sloped structure is disclosed. The method includes the steps of: (a) forming a sacrificial film above a substrate; (b) forming a first film above the sacrificial film, the first film having a first portion connected to the substrate, a second portion located above the sacrificial film, a third portion located between the first portion and the second portion, and a thin region in a portion of the third portion or in a boundary section between the second portion and the third portion and having a thickness smaller than the first portion; (c) removing the sacrificial film; and (d) bending the first film in the thin region, after the step (c), thereby sloping the second portion of the first film with respect to the substrate.
Claims17
A sloped structure comprising:
- a first portion connected to a first surface of a substrate;
- a second portion sloped with respect to the first surface of the substrate;
- and
- a third portion connecting the first portion and the second portion together, and having a thin region thinner than the first portion or the second portion,
- wherein an end portion of the second portion is adhered to the substrate, the end portion being at an end of the second portion opposite to a third portion side of the second portion.
Dependencies are inferred from the claim text.