Module for ozone cure and post-cure moisture treatment

A substrate processing system comprising:

• a plurality of deposition chambers;
• a load-lock chamber;
• a first robotic arm operable to move a substrate between one of the deposition chambers and the load-lock chamber;
• a pair of substrate curing and treatment modules disposed on opposite ends of the load-lock chamber, wherein each of the substrate curing and treatment module comprises:
• a curing chamber for curing a dielectric layer in an atmosphere comprising ozone;
• a treatment chamber for treating the cured dielectric layer in an atmosphere comprising water vapor, wherein the curing chamber is vertically positioned with respect to the treatment chamber;
• a heating system operatively coupled to the curing chamber and the treatment chamber, wherein the heating system is operative to adjust a first temperature of the curing chamber to from about 150° C. to about 200° C., and to adjust a second temperature of the treatment chamber to from about 80° C. to about 100° C.;
• and
• an access door on both the curing chamber and the treatment chamber, wherein each of the access doors are operable to be moved to an open position to receive a substrate, and operable to be moved to a closed sealed position while the substrate is being cured or treated;
• and
• a second robotic arm operable to move the substrate between the load-lock chamber and the curing chamber of the substrate curing and treatment module.