Process for fabricating a monolayer or multilayer metal structure in LIGA technology, and structure obtained

A process for fabricating simultaneously a plurality of monolayer or multilayer metal structures in LIGA technology, comprising, in sequence:

• a) depositing a photoresist layer on a flat bulk metal substrate,
• b) creating a plurality of photoresist molds by irradiation or electron or ion bombardment,
• c) electroplating a metal or alloy in these molds to form electroformed metal structures,
• d) carrying out one or more machining operations on the upper face of the electroformed metal structures,
• e) detaching the electroformed metal structures and the photoresist layer from the substrate, wherein the photoresist layer is un-separated from the metal structures,
• f) carrying out at least one of (i) etching the electroplated metal or alloy of the detached metal structures, (ii) activating the electroplated metal or alloy of the detached metal structures by applying a reverse current, (iii) marking the electroplated metal or alloy of the detached metal structures by mechanical marking, and (iv) marking the electroplated metal or alloy of the detached metal structures by laser marking operations on the detached metal structures, wherein the photoresist layer is un-separated from the metal structures,
• and
• g) separating the photoresist from the metal structures,
• wherein the bulk metal substrate on which the photoresist layer is deposited is a passivated bulk metal substrate for separating the metal structures and the photoresist from the bulk metal substrate by delamination.