Silane/urea compound as a heat-activated curing agent for epoxide resin compositions

A thermosetting epoxy resin composition comprising:

• at least one epoxy resin EH having, on average, more than one epoxide group per molecule;
• and
• at least one silane of formula (I);
• wherein A is an optionally branched alkylene group containing 1 to 4 C atoms, or a phenylene group;
• wherein Z1 is H or an alkyl group containing 1 to 4 C atoms;
• wherein Z2 is H, a phenyl group, or an alkyl group containing 1 to 8 C atoms;
• wherein Z3 is:
• H,
• a monofunctional aromatic or cycloaliphatic or aliphatic group containing 1 to 8 C atoms, which optionally contains at least one carboxylate, nitrile, nitro, phosphonate, or sulfonic or sulfonate group, or
• a group having a formula of A-Si(Z2)3-a(OZ1)a;
• wherein Z4 is H or a monofunctional aromatic or cycloaliphatic or aliphatic group containing 1 to 8 C atoms;
• wherein Z5 is:
• a bi-functional aromatic or araliphatic or cycloaliphatic or aliphatic group containing 1 to 40 C atoms, or
• a group having a formula of A-Si(Z2)3-a(OZ1)a;
• wherein X is O or S;
• wherein a is 1 or 2 or 3;
• and
• wherein b is 1 or 2 or 3 or 4;
• with the proviso that either Z3 or Z4 is H.