MEMS devices anti-stiction coating and encapsulant having opposing water resitive characteristics

Abstract

Disclosed is an isolation mechanism and technique for packaging a MEMS transducer, such as a bulk acoustic wave gyroscope or accelerometer, to provide isolation from externally applied (or internally induced) stress, strain, vibration, shock and thermal transients. The disclosed methods and techniques enable the location of voids/air cavity/environmental isolations inside an encapsulant or over mold compound to be custom selected by treating at least a portion of the exterior surfaces of the MEMS device package with anti-stiction coatings to create opposing hydrophobic and hydrophilic conditions which during encapsulant and transfer molding steps create voids or air bubbles in the proximity of the anti-stiction coating due to the opposing water resistive characteristic of encapsulant.

Dependencies are inferred from the claim text.