Method and apparatus for placing adhesive element on a matrix

An apparatus for positioning, holding and moving formed adhesive elements for attachment to a bonding part, the apparatus comprising:

• a matrix plate having at least one aperture;
• a formed adhesive element holding hopper operatively associated with said matrix plate, one of said matrix plate and said hopper being movable with respect to the other;
• and
• an ejector system having at least one ejector stamp partially positionable within said at least one aperture of said matrix plate, said system including an ejector body and a movable lifting body operatively associated with said ejector body, said ejector body having an air inlet and said lifting body having attached thereto an air inlet shut off shaft at least partially positionable within said air inlet.

A method of positioning, holding and moving formed adhesive elements for attachment to a bonding part comprising the steps of:

• forming a positioning, holding, and moving apparatus including a matrix plate having at least one aperture for receiving a formed adhesive element, a formed adhesive element holding hopper, and an ejector system having at least one ejector stamp partially positionable within said at least one aperture, said ejector system including an ejector body and a movable lifting body operatively associated with said ejector body, said ejector body having an air inlet and said lifting body having attached thereto an air inlet shut off shaft at least partially positionable within said air inlet;
• moving one of said matrix plate or said hopper to a position in which said hopper is above said at least one aperture;
• allowing a formed adhesive element to exit said hopper and locate in said at least one aperture;
• moving one of said matrix plate or said hopper to a position in which said hopper is not above said at least one aperture;
• positioning a bonding part above said formed adhesive element;
• and
• causing said ejector system to move said at least one ejector stamp to move said formed adhesive element into contact with said bonding part.