Semiconductor device and cooling system for semiconductor device
AssigneeMitsubishi Electric Corporation
InventorsNoboru Miyamoto, Mitsunori Aiko
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Abstract
A semiconductor device of the present invention is a semiconductor device applicable in a cooling system including an ECU functioning as a setting part that sets target temperature of a refrigerant used to cool the semiconductor device, and a sensor functioning as a detector that detects the temperature of the refrigerant as refrigerant's temperature. The semiconductor device generates variable heating loss. The semiconductor device includes a heating controller that controls the heating loss in the semiconductor device such that the target temperature and the refrigerant's temperature become the same.
Claims21
A semiconductor device applicable in a cooling system including a setting part that sets target temperature of a refrigerant used to cool the semiconductor device, a detector that detects the temperature of said refrigerant as refrigerant's temperature, and a heat exchanger that performs heat exchange with a heat exchange target by using said refrigerant, the semiconductor device generating variable heating loss, the semiconductor device comprising:
- a heating controller that controls said heating loss in said semiconductor device such that said target temperature and said refrigerant's temperature become the same,
- wherein said heat exchanger guides said refrigerant to a bypass flow path from a primary flow path by switching a flow path bypass switch and then performs heat exchange with said heat exchange target.
A cooling system, comprising:
- a semiconductor device mounted on an electrically powered member driven with electric power and operating the electrically powered member;
- a cooler that cools said semiconductor device with a refrigerant;
- a setting part that sets target temperature of said refrigerant;
- a detector that detects the temperature of said refrigerant as refrigerant's temperature;
- and
- a heat exchanger that performs heat exchange with a heat exchange target in said electrically powered member by using said refrigerant,
- said semiconductor device generating variable heating loss,
- the cooling system further comprising a heating controller that controls said heating loss in said semiconductor device such that said target temperature and said refrigerant's temperature become the same,
- wherein said heat exchanger guides said refrigerant to a bypass flow path from a primary flow path by switching a flow path bypass switch and then performs heat exchange with said heat exchange target.
Dependencies are inferred from the claim text.