Back to results
US 9,283,737 B2Granted
Joining process for the cohesive connection, in sections, of at least two components
AssigneeJohnson Controls Technology Company
InventorsRobin Ndagijimana, Simon Fleischheuer, Harald Mund, Wolfgang Pellenz
Life of this patent
Estimating the term…
Abstract
In a joining process for the cohesive connection of at least two components, a profile component is cohesively connected to a component of areal form. Formed into the component of areal form is at least one stamped portion, the height of which is formed so as to correspond to a minimum layer thickness of the cohesive connection.
Claims9
A joining process for a cohesive connection of at least two components, comprising:
- cohesively connecting a profile component, which has at least one substantially planar flange region, to a shaped component by
- stamping a two-dimensional portion of the shaped component to introduce at least one stamped portion into the shaped component, wherein the stamped portion is configured to receive the planar flange region of the profile component,
- disposing an adhesive between the profile component and the shaped component only in the stamped portion,
- placing the substantially planar flange region of the profile component onto the stamped portion of the shaped component,
- wherein an entire width of the stamped portion corresponds to an entire width of the planar flange region,
- wherein the height of the stamped portion corresponds to a minimum layer thickness of the adhesive.
3 more elements
Dependencies are inferred from the claim text.