Method for manufacturing solder column, apparatus for manufacturing solder column, and solder column

An apparatus for performing the method of manufacturing a solder column, comprising:

• a main body section having an insert opening for allowing a solder wire to be inserted and a discharge opening from which the solder wire inserted into the insert opening is discharged;
• a conveying mechanism that conveys the solder wire from the insert opening toward the discharge opening;
• a first cutting blade that cuts the solder wire projecting from the discharge opening, the first cutting blade being provided in position to slide against the discharge opening;
• a second cutting blade that cuts the solder wire inserted into the insert opening, the second cutting blade being provided in position to slide against the insert opening;
• wherein each of the first and second cutting blades is a single edge blade in which a parallel surface is in parallel with a direction in which each blade extends, and an inclined surface is at a predetermined angle to the parallel surface, and the inclined surface of the first cutting blade is inclined in an opposite direction to the inclined surface of the second cutting blade;
• the parallel surface of the first cutting blade sliding against the discharge opening when cutting the solder wire and the parallel surface of the second cutting blade sliding against the insert opening when cutting the solder wire;
• a third cutting blade that cuts the solder wire to be inserted into the insert opening;
• a controlling portion that causes the solder wire to be projected from the discharge opening by the conveying mechanism, causes the projected solder wire to be cut with the first cutting blade and causes the solder wire inserted into the insert opening to be cut with the second cutting blade and;
• wherein the solder wire is supported between the insert opening and the discharge opening and the solder wire is not supported between the second and third cutting blades.