Apparatus including electrical lapping guide and methods of using the same
AssigneeSeagate Technology LLC
InventorsYongjun Zhao, David C. Seets, Mark Ostrowski
Life of this patent
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Abstract
An electrical lapping guide has a body with a thickness along a wafer axis, the body comprising a layer of conductive material having a resistivity. The conductive material layer comprises a first contact region and a second contact region, the first and second contact regions configured to electrically connect the electrical lapping guide to electrical leads. A lapping edge comprises an air-bearing plane axis perpendicular to a lapping axis, and a back edge opposite the lapping edge, the back edge comprising a plurality of notches.
Claims25
An apparatus comprising:
- an electrical lapping guide comprising:
- a body having a thickness along a wafer axis, the body comprising:
- a first contact region and a second contact region having a minimal distance therebetween, the first and second contact regions configured to electrically connect the electrical lapping guide to electrical leads;
- a lapping edge comprising an air-bearing plane axis, the air-bearing plane axis being perpendicular to a lapping axis;
- and
- a back edge opposite the lapping edge, the back edge comprising a plurality of notches;
- and
- a layer of conductive material having a resistivity.
An apparatus, comprising:
- a pre-processed wafer comprising:
- at least one pre-processed feature disposed on the wafer;
- at least one electrical lapping guide comprising:
- first and second contact regions configured to electrically connect the electrical lapping guide to electrical leads;
- a lapping edge comprising an air-bearing plane axis, the air-bearing plane axis being perpendicular to a lapping axis;
- and
- a back edge opposite the lapping edge, the back edge comprising a plurality of notches,
- the at least one pre-processed feature disposed adjacent to the at least one electrical lapping guide along the air-bearing plane axis.
A method comprising:
- applying pressure with a lapping tool to a pre-processed wafer comprising a lapping surface, at least one preprocessed feature, and at least one electrical lapping guide, the electrical lapping guide comprising:
- first and second contact regions configured to electrically connect the electrical lapping guide to electrical leads;
- a lapping edge comprising an air-bearing plane axis, the air-bearing plane axis being perpendicular to a lapping axis;
- and
- a back edge opposite the lapping edge, the back edge of the electrical lapping guide comprising a plurality of notches,
- the at least one pre-processed feature disposed adjacent to the at least one electrical lapping guide along the air-bearing plane axis;
- detecting a resistance between the first and second contact region of the electrical lapping guide;
- and
- removing the lapping tool when the resistance across the electrical lapping guide reaches a predetermined value.
Dependencies are inferred from the claim text.