Sacrificial layers for bio-compatible devices
AssigneeVerily Life Sciences LLC
InventorsHarvey Ho, James Etzkorn, Huanfen Yao
Life of this patent
Estimating the term…
Abstract
A method may involve: forming a sacrificial layer on a working substrate; forming a first bio-compatible layer on the sacrificial layer such that the first bio-compatible layer adheres to the sacrificial layer; forming a conductive pattern on the first bio-compatible layer; mounting an electronic component to the conductive pattern; forming a second bio-compatible layer over the first bio-compatible layer, the electronic component, and the conductive pattern; and removing the sacrificial layer to release the bio-compatible device from the working substrate. The first bio-compatible layer defines a first side of a bio-compatible device. The second bio-compatible layer defines a second side of the bio-compatible device.
Claims18
A method comprising:
- forming a sacrificial layer on a working substrate;
- forming a first bio-compatible layer on the sacrificial layer such that the first bio-compatible layer adheres to the sacrificial layer, wherein the first bio-compatible layer defines a first side of a bio-compatible device;
- forming a conductive pattern on the first bio-compatible layer;
- mounting an electronic component to the conductive pattern;
- forming a second bio-compatible layer over the first bio-compatible layer, the electronic component, and the conductive pattern, wherein the second bio-compatible layer defines a second side of the bio-compatible device;
- and
- removing the sacrificial layer to release the bio-compatible device from the working substrate.
Dependencies are inferred from the claim text.