Current, temperature or electromagnetic field actuated fasteners

An adhesive connection for bonding or debonding objects upon exposure to an actuating condition, comprising:

• a first object including a first substrate with a 2 dimensional (2D) array of moveable features thereon which each provide an actuated state and a non-actuated state, said movable features including engagers that are mechanically coupled to respective bimetallic spring coil actuators, said engagers having a protrusion from said first substrate in said actuated state that is different than said protrusion from said substrate in said non-actuated state, said bimetallic spring coil actuators responding to application of a change in temperature of said bimetallic spring coil actuator by changing between said actuated state and said non-actuated state;
• and
• a second object having a 2D array of loops on a second substrate, wherein said moveable features while in one of said actuated state and said non-actuated state are positioned, sized and shaped to fit within said array of loops,
• wherein upon changing a magnitude of said temperature, a state change is triggered between said actuated state and said non-actuated state, and
• wherein said state change results in a bonding event or a debonding event between said first object and said second object.